Lenovo’s VP confirmed the inclusion of the Instinct MI400 HPC APU Accelerator as part of AMD New Roadmap

Lenovo’s VP confirmed the inclusion of the Instinct MI400 HPC APU Accelerator as part of AMD New Roadmap

In a recent interview, Lenovo’s VP confirmed the inclusion of the Instinct MI400 HPC APU Accelerator as part of AMD’s Instinct Roadmap. This cutting-edge technology will provide a significant boost to high-performance computing, making it a valuable addition to any data center or enterprise environment. The Instinct MI400 will deliver unparalleled performance and efficiency, making it a must-have for any organization looking to stay ahead of the curve in the competitive world of technology.

AMD is set to shake up the server market with its upcoming Instinct MI300 APU, an engineering marvel that combines x86 CPU and GPU cores for the server segment. But the company isn’t content to rest on its laurels, as Lenovo’s Vice President recently confirmed that the next-gen Instinct MI400 is already in the works and planned for the company’s roadmap.

The Instinct MI300 is set to deliver a massive boost to high-performance computing, making it a valuable addition to any data center or enterprise environment. However, the Instinct MI400 promises to take things even further, with even more powerful performance and efficiency.

This is a clear indication that AMD is not content to sit back and let the competition catch up. Instead, the company is pushing the boundaries of technology and staying ahead of the curve. It’s an exciting time for the server market, and we can’t wait to see what the Instinct MI400 brings to the table.

At CES 2023, AMD provided further details on the specifications of its revolutionary Instinct MI300 APU. As the world’s first data center chip to feature an integrated x86 CPU and GPU architecture, this chip represents a major leap forward in chipmaking technology. With an impressive 146 billion transistors, the Instinct MI300 is truly at the forefront of what is currently possible in the industry. Additionally, it utilizes advanced 3D Chiplet packaging technology, which combines the advantages of TSMC’s 5nm and 6nm IPs in a single unit. This is a significant achievement and a clear indication of AMD’s leadership in the field of high-performance computing.


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Mark Wood
By Mark Wood

Mark is a tech-geek who enjoys exploring gadgets for tutorials. On pc9x.com, he shares his thoughts on what's going on in the world of software and hardware. He has changed a lot since the release of Valve's Steam Deck and NVIDIA RTX 4090, which makes him excited to be in the Metaverse; meanwhile, Mark is a busy person trying to keep up with trends.